Conjunct Ltd: Lens Free Glass OSAs
Fibre-Lyte is a lens free optical sub-assembly on a glass substrate for deployment in demanding environments. This patented technology uses precise multi-layer tracks on borosilicate into which optical waveguides are processed. This configuration provides outstanding RF performance at 50G and a robust, stable optical performance over a wide temperature range.
Waveguides
Fibre-Lyte uses in-wafer waveguides as a robust alternative to complex and expensive lens assemblies.
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No beam expansion.
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Reduced cross talk.
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Single and multimode support.
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No air gaps for particle contamination.
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No condensation ingress.
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No CTE mismatch.
High-definition Tracks
Fibre-Lyte uses multi-layer wafer scale fabrication leading to finer tracks and layers than is possible in FR4.
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Thick and thin film processing.
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Improved definition.
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Better RF control.
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Tighter layer spacing than FR4.
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Improved ground plane control.
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Multiple materials on a single layer.
Flip-Chip
Flip-chip assembly avoids the use of wire bonds, improving RF performance at 50G and making the assembly mechanically robust.
Superior Thermal Management
Direct to die thermal path provides improved thermal management.
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The heat spreader is mounted directly to the opto-electronic devices.
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It efficiently spreads the heat from these devices on to an appropriate heat sink.
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Allows use of higher power components due to optimised thermal path.
Electrical and Optical Interfacing
Electrical interfacing of Fibre-Lyte uses standard processes:
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Solder reflow compatible BGA interface.
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Add directly to a PCB or to a carrier interposer as shown below for electrical replaceability.
Optical interfacing can be either horizontal or vertical:
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Simple two-dimensional alignment operation.
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Clear optical interface.
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MT compatible top surface.
4+4 x25G Transceiver Specification
Fibre-Lyte packages a selection of off-the-shelf components and achieves high performance with them.
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850nm Tx and Rx
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0-85C typical (VCSEL limited)
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13.4dB link budget
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<1.5W power consumption.
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1E-12 capable.
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Extremely low crosstalk.
Hi-Rel Environments
The OSA of choice for harsh environments or where reliability is key.
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Co-packaged optics.
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CTE well matched between optical substrate and die.
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No air-gap needed for lensing.