Optical Sub-Assembly (OSA)

Conjunct is developing proprietary technology for a low-cost optical sub-assembly aimed at the datacom market. It provides a small footprint, low profile wafer level package ideal for mass production using existing equipment. The technology has the following characteristics:

• Datacom Centric: This technology is designed for use with multimode fibre at distances of 500m or less and works at 850nm.  The device is intended for use in the 1Gbps^-1 to 4Gbps^-1 bandwidth space.

• TO Can Replacement: The technology replaces TO can based assemblies in datacom applications. Cost reduction and efficient use of space are key drivers, with MT-RJ and MTP cables being significantly more front-panel friendly than LC.

Existing systems use TO cans as follows:

The OSA replaces the TO can:

• Passive alignment: Such products are cheaper to assemble than their active counterparts. Inherent mechanical alignment features are referenced to optical positions.

• Integrated optical system: The optical structures required to interface with fibres will be built into the optical module used for assembly, thus reducing cost.

• Wafer level assembly: Vertical optical emission and detection die will be bonded directly onto an electrically tracked optical wafer. History has shown that the lower the level at which systems are integrated, the greater the potential cost reduction will be over time.

• System in package (SiP): Integration of additional electronic die such as amplifiers and drivers will be possible directly on the optical head.

• BGA package: A compact package that can be flexed or surface mounted.

OSA top view - approx. 1mm x 1mm.

Devices produced in volume on a wafer.

This is preliminary product information only - please contact us for up to date information. Roadmap: CJT-OSA-A-TXXX-02D, followed by CJT-OSA-A-TLMD-02D.